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Engineering

Mathematics & Science

Gt Product Group

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B2B GT

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B2B & B2C

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Advanced Flip Chip Packaging

POST SECONDARY FOUR YEAR

PROFESSIONAL & REFERENCE

COLFR

COLSO

COLJR

COLSR

ADVANCED FLIP CHIP PACKAGING

Duration

Duration Unit Of Measure

Transaction Type

Front Cover.
Half Title Page.
Title Page.
Copyright Page.
Preface.
Contents.
1: Market Trends: Past, Present, and Future.
2: Technology Trends: Past, Present, and Future.
3: Bumping Technologies.
4: Flip-Chip Interconnections: Past, Present, and Future.
5: Flip Chip Underfill: Materials, Process, and Reliability.
6: Conductive Adhesives for Flip-Chip Applications.
7: Substrate Technology.
8: IC-Package-System Integration Design.
9: Thermal Management of Flip Chip Packages.
10: Thermo-Mechanical Reliability in Flip-Chip Packages.
11: Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.

Advanced Flip Chip Packaging.css-1p8rvzy{position:absolute;padding-left:8px;}

Advanced Flip Chip Packaging