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Embedded Memory Design for Multi-Core and Systems on Chip

ACSP: EMBEDDED MEMORY DSGN MULTI-CORE & SYSTMS ON CHIP

Engineering

Mathematics & Science

Gt Product Group

Binding Format

Marketing Imprint Name

B2B GT

CL Carton Count

Imprint Name

B2B & B2C

This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.

POST SECONDARY FOUR YEAR

COLFR

COLSO

COLJR

COLSR

Duration

Duration Unit Of Measure

Transaction Type

Front Cover.
Other Frontmatter.
Title Page.
Copyright Page.
Preface.
Contents.
List of Figures.
List of Tables.
1: Introduction.
2: Cache Architecture and Main Blocks.
3: Embedded Memory Hierarchy.
4: SRAM-Based Memory Operation and Yield.
5: Power and Yield for SRAM Memory.
6: Leakage Reduction.
7: Embedded Memory Verification.
8: Embedded Memory Design Validation and Design for Test.
9: Emerging Memory Technology Opportunities and Challenges.
References.

Embedded Memory Design for Multi-Core and Systems on Chip.css-1p8rvzy{position:absolute;padding-left:8px;}

Embedded Memory Design for Multi-Core and Systems on Chip