Copper Electrodeposition for Nanofabrication of Electronics Devices

Publisher Springer

Format

eBook

2nd Edition 1st Edition

Quantity

Contact representative

Publisher

Springer

Volume

Copyright

2014

ISBN13

9781461491767

Release

Format

eBook

Grade Level

College Freshman - 170

DDC
TBD

Overview

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: � ULSI wiring material based upon copper nanowiring � Printed circuit boards � Stacked semiconductors � Through Silicon Via � Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Front Cover.
Other Frontmatter.
Title Page.
Copyright Page.
Preface.
Contents.
1: Copper Electrodepositon and Additive Chemistry.
2: Copper Electrodepositon.
3: Supression Effect and Additive Chemistry.
4: Acceleration Effect.
5: Modeling and Simulation.
6: Copper on Chip Metallization.
7: Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects.
8: Microstructure Evolution of Copper in Nanoscale Interconnect Features.
9: Direct Copper Plating.
10: Through Silicon Via and Other Methods.
11: Through Silicon Via.
12: Build-up Printed Wiring Boards (Build-up PWBs).
13: Copper Foil Smooth on Both Sides for Lithium-Ion Battery.
14: Through Hole Plating.
15: Erratum to: Acceleration Effect.
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