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Copper Electrodeposition for Nanofabrication of Electronics Devices

NSST: COPPER ELCTRDPSTN FOR NANOFBCTN OF ELECTRNCS DVCS

Nanotechnology

Mathematics & Science

Gt Product Group

Binding Format

Marketing Imprint Name

B2B GT

CL Carton Count

Imprint Name

B2B & B2C

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

POST SECONDARY FOUR YEAR

PROFESSIONAL & REFERENCE

COLFR

COLSO

COLJR

COLSR

Duration

Duration Unit Of Measure

Transaction Type

Front Cover.
Other Frontmatter.
Title Page.
Copyright Page.
Preface.
Contents.
1: Copper Electrodepositon and Additive Chemistry.
2: Copper Electrodepositon.
3: Supression Effect and Additive Chemistry.
4: Acceleration Effect.
5: Modeling and Simulation.
6: Copper on Chip Metallization.
7: Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects.
8: Microstructure Evolution of Copper in Nanoscale Interconnect Features.
9: Direct Copper Plating.
10: Through Silicon Via and Other Methods.
11: Through Silicon Via.
12: Build-up Printed Wiring Boards (Build-up PWBs).
13: Copper Foil Smooth on Both Sides for Lithium-Ion Battery.
14: Through Hole Plating.
15: Erratum to: Acceleration Effect.

Copper Electrodeposition for Nanofabrication of Electronics Devices.css-1p8rvzy{position:absolute;padding-left:8px;}

Copper Electrodeposition for Nanofabrication of Electronics Devices