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Engineering

Mathematics & Science

Gt Product Group

Binding Format

Marketing Imprint Name

B2B GT

CL Carton Count

Imprint Name

B2B & B2C

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

High-Bandwidth Memory Interface

POST SECONDARY FOUR YEAR

PROFESSIONAL & REFERENCE

COLFR

COLSO

COLJR

COLSR

SBECE: HIGH-BANDWIDTH MEMORY INTERFACE

Duration

Duration Unit Of Measure

Transaction Type

Front Cover.
Other Frontmatter.
Title Page.
Copyright Page.
Preface.
Contents.
1: An Introduction to High-Speed DRAM.
2: An I/O Line Configuration and Organization of DRAM.
3: Clock Generation and Distribution.
4: Transceiver Design.
5: TSV Interface for DRAM.
Index.

High-Bandwidth Memory Interface.css-1p8rvzy{position:absolute;padding-left:8px;}

High-Bandwidth Memory Interface