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Gt Product Group

Binding Format

Marketing Imprint Name

B2B GT

CL Carton Count

Imprint Name

B2B & B2C

Provides an overview of the wide range of topics which comprise the microsystems field, including, design and materials, fabrication and packaging, optical systems, chemical and biological systems, physical sensors, actuation, electronics for MEMS and industrial applications.

Comp Microsystems

COLFR

COLJR

COLSO

COLSR

COMPREHENSIVE MICROSYSTEMS 3V

Duration

Duration Unit Of Measure

Transaction Type

Front Cover.
Half Title Page.
Title Page.
Copyright Page.
Contents.
Foreword.
Preface.
Editors-in-Chief.
Acknowledgments.
Contributors to Volume 1.
Contents of All Volumes.
Materials.
Silicon and Related Materials.
Compound Semiconductors.
Metals and Alloys.
Polymers.
Biocompatibility of Microsystems.
Harsh Environment Materials.
Fabrication and Packaging.
Wet Etching.
Dry Etching.
Wafer Bonding.
Electrodeposition.
LIGA.
Low-Cost MEMS Technologies.
Micromachining.
Self-Assembly.
Packaging.
Electronics and Systems Design.
Interface Circuits.
Testing, Calibration and Compensation.
Multiphysics and Multiscale Simulation.
Systematic Synthesis Methods.

Comp Microsystems.css-1p8rvzy{position:absolute;padding-left:8px;}

Comp Microsystems