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Engineering

Mathematics & Science

Gt Product Group

Binding Format

Marketing Imprint Name

B2B GT

CL Carton Count

Imprint Name

B2B & B2C

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Design for Manufacturability

POST SECONDARY FOUR YEAR

PROFESSIONAL & REFERENCE

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COLJR

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DESIGN FOR MANUFACTURABILITY

Duration

Duration Unit Of Measure

Transaction Type

Front Cover.
Half Title Page.
Title Page.
Copyright Page.
About the Author.
Contents.
Preface.
1: Classic DfM: From 2D to 3D.
2: DfM at 28 nm and Beyond.
3: New DfM Domain: Stress Effects.
4: Closure and Future Work.
Appendix.

Design for Manufacturability.css-1p8rvzy{position:absolute;padding-left:8px;}

Design for Manufacturability