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Design And Modeling For 3D LCS And Interposers

DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS

Engineering

Mathematics & Science

Gt Product Group

Binding Format

Marketing Imprint Name

B2B GT

CL Carton Count

Imprint Name

B2B & B2C

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

POST SECONDARY FOUR YEAR

COLFR

COLJR

COLSO

COLSR

Duration

Duration Unit Of Measure

Transaction Type

Front Cover.
Half Title Page.
Other Front Matter.
Title Page.
Copyright Page.
Dedication.
Preface.
Contents.
Acknowledgement.
1: System Integration and Modeling Concepts.
2: Modeling of Cylindrical Interconnections.
3: Electrical Modeling of through Silicon Vias.
4: Electrical Performance and Signal Integrity.
5: Power Distribution, Return Path Discontinuities and Thermal Management.
6: Alternate Methods for Power Distribution.
Appendix.
Index.
About the Authors.

Design And Modeling For 3D LCS And Interposers.css-1p8rvzy{position:absolute;padding-left:8px;}

Design And Modeling For 3D LCS And Interposers